AFS600-FG256K vs AFS600-FG256 Comparison
Detailed side-by-side comparison of AFS600-FG256K by Microchip Technology and AFS600-FG256 by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | AFS600-FG256K | AFS600-FG256 |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| System Gates | 600,000 system gates | 600,000 gates |
| Logic Cells | 13,824 logic cells | — |
| Device Type | Fusion mixed-signal FPGA | FPGA |
| Programmable Logic | Flash-based CMOS programmable logic | — |
| Configuration Technology | Nonvolatile flash configuration | — |
| Power-Off Retention | Program retained when powered off | — |
| Power-Up Behavior | Live at Power-Up (LAPU) | Live at Power-Up (LAPU) |
| Process Technology | 130 nm CMOS | 130 nm |
| Metal Layers | 7 metal layers | 7 layers |
| Logic Family | CMOS | CMOS |
| Supply Voltage | 1.5 V | 1.5 V |
| Operating Temperature Range | 0°C to 70°C | — |
| Package Type | BGA-256, 1.0 mm pitch | 256-pin low-profile BGA |
| Pin Count | 256 pins | 256 pins |
| Mounting Type | Surface mount | — |
| ARM Support | Optional ARM support in the Fusion family | — |
| Product Type | — | Fusion mixed-signal FPGA |
| User I/O Count | — | 119 I/Os |
| Embedded Memory | — | 110,592 bits |
| Configuration Memory | — | Nonvolatile flash-based CMOS |
| Package Pitch | — | 1.0 mm |
| Operating Temperature | — | 0 C to 70 C |
| Analog Capability | — | Configurable analog blocks |
| Clock Capability | — | Integrated clock generation and management circuitry |
| Maximum Frequency | — | 1098.9 MHz |
| RoHS Status | — | [DATA_NEEDED: RoHS status] |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification status] |