AFS600-FGG256K vs AFS600-FG256K Comparison

Detailed side-by-side comparison of AFS600-FGG256K by Microchip Technology and AFS600-FG256K by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
AFS600-FGG256K AFS600-FGG256K - 600K-Gate Fusion FPGA | Microchip Technology

AFS600-FGG256K - 600K-Gate Fusion FPGA | Microchip Technology

AFS600-FGG256K ✓ Active
Microchip Technology
AFS600-FG256K AFS600-FG256K - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FG256K - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-FG256K ✓ Active

Specification Comparison

Parameter AFS600-FGG256K AFS600-FG256K
Brand Microchip Technology Microchip Technology
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Fusion mixed-signal field-programmable gate array (FPGA) Fusion mixed-signal FPGA
System Gates 600,000 gates 600,000 system gates
User I/O 119 I/O —
Embedded Flash Memory 110,592 bits —
Supply Voltage 1.5 V 1.5 V
Logic Family CMOS CMOS
Package Type 256-pin FBGA BGA-256, 1.0 mm pitch
Package Ball Pitch 1.0 mm —
Total Pins 256 pins —
Operating Temperature 0°C to +70°C —
Process Technology 130 nm flash-based CMOS 130 nm CMOS
Metal Layers 7 layers 7 metal layers
Configuration Memory Type Embedded nonvolatile flash —
Power-Off Data Retention Yes —
Live at Power-Up Yes —
Listed Maximum Frequency 1098.9 MHz —
Mounting Type Surface mount Surface mount
RoHS Status unknown —
REACH Status unknown —
Logic Cells — 13,824 logic cells
Programmable Logic — Flash-based CMOS programmable logic
Configuration Technology — Nonvolatile flash configuration
Power-Off Retention — Program retained when powered off
Power-Up Behavior — Live at Power-Up (LAPU)
Operating Temperature Range — 0°C to 70°C
Pin Count — 256 pins
ARM Support — Optional ARM support in the Fusion family

Datasheets & Resources

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