APA150-FG144 vs APA150-FG144I Comparison
Detailed side-by-side comparison of APA150-FG144 by Microchip Technology and APA150-FG144I by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Microchip Technology
APA150-FG144 - 150K System Gates ProASICPLUS FPGA | Microchip
APA150-FG144 ✓ ActiveMicrochip Technology
APA150-FG144I - 150K-Gate Flash FPGA | Microchip | 144-LBGA
APA150-FG144I ✓ ActiveSpecification Comparison
| Parameter | APA150-FG144 | APA150-FG144I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Device Type | ProASICPLUS field-programmable gate array (FPGA) | ProASICPLUS field-programmable gate array |
| System Gates | 150K system gates | — |
| Number of I/O | 100 I/O | — |
| Configuration Memory | 36,864 bits | — |
| Package | 144-LBGA | — |
| Configuration Technology | Flash-based, nonvolatile configuration | — |
| Manufacturer | Microchip Technology | — |
| Programmable Logic Type | FPGA | — |
| Logic Density | 150,000 system gates | — |
| User I/O Count | 100 | 100 I/Os |
| Configuration Bit Count | 36,864 bits | — |
| Mounting Type | Surface mount | Surface mount |
| Package Family | LBGA | — |
| Operating Voltage | [DATA_NEEDED: operating voltage] | — |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | -40 °C to +85 °C |
| I/O Standards | [DATA_NEEDED: supported I/O standards] | — |
| Maximum Clock Frequency | [DATA_NEEDED: maximum clock frequency] | — |
| Power Consumption | [DATA_NEEDED: power consumption] | — |
| RoHS Status | RoHS non-compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free Status | Contains lead | — |
| Programmable Logic Capacity | — | 150K system gates |
| Configuration Memory Technology | — | Nonvolatile flash |
| Power-Up Behavior | — | Live at power-up |
| Programmability | — | Reprogrammable |
| Package Type | — | 144-LBGA square surface-mount package |
| Terminal Count | — | 144 balls |
| Package Dimensions | — | 13 mm x 13 mm |
| Temperature Grade | — | Industrial grade |
| Supply Voltage | — | 2.3 V to 2.7 V |
| Power Consumption Characteristic | — | Lower dynamic power consumption than SRAM FPGAs |
| Power-On Current Surge | — | No SRAM-style power-on configuration current surge |
| Design Flow | — | ASIC-oriented FPGA design flow |
| REACH Status | — | [DATA_NEEDED: REACH status] |
| AEC-Q100 Qualification | — | [DATA_NEEDED: AEC-Q100 qualification status] |