ATMEGA325PA-MUR vs ATMEGA325PV-10MU Comparison

Detailed side-by-side comparison of ATMEGA325PA-MUR by Microchip Technology and ATMEGA325PV-10MU by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
ATMEGA325PA-MUR ATMEGA325PA-MUR - 8-bit AVR MCU 32KB 20MHz 64-QFN | Microchip

ATMEGA325PA-MUR - 8-bit AVR MCU 32KB 20MHz 64-QFN | Microchip

ATMEGA325PA-MUR βœ“ Active
Microchip Technology
ATMEGA325PV-10MU ATMEGA325PV-10MU - AVR 8-bit MCU 32KB 10MHz 64-QFN | Microchip

ATMEGA325PV-10MU - AVR 8-bit MCU 32KB 10MHz 64-QFN | Microchip

ATMEGA325PV-10MU βœ“ Active

Specification Comparison

Parameter ATMEGA325PA-MUR ATMEGA325PV-10MU
Brand Microchip Technology Microchip Technology
Category Microcontrollers Microcontrollers
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $1.65 $2.19
Core Architecture 8-bit AVR RISC β€”
Flash Program Memory 32 KB (16K x 16) β€”
SRAM 2 KB β€”
EEPROM 1 KB β€”
Maximum Clock Frequency 20 MHz 10 MHz
Peak Throughput 20 MIPS at 20 MHz β€”
Supply Voltage Range 1.8 V to 5.5 V 1.8 V to 5.5 V
ADC 8-channel 10-bit 10-bit (ATmega325P family)
Debug Interface JTAG (on-chip debug, boundary scan) β€”
Low-Power Technology picoPower β€”
Package 64-QFN (MLF) 9x9 mm, exposed pad 64-QFN (9x9 mm) with exposed pad
Mounting Type Surface Mount Surface Mount
Temperature Range Industrial β€”
Instructions 131 powerful instructions, most single-cycle β€”
Packaging / Reeling Tape & Reel (R suffix), GREEN β€”
RoHS Status Compliant (GREEN package) unknown
Core β€” AVR 8-bit RISC
Program Memory Size β€” 32 KB (16K x 16) Flash
RAM Size β€” 2 KB
EEPROM Size β€” 1 KB
Number of I/O β€” 54 (32 I/O ports listed in legacy datasheet summary)
Temperature Grade β€” Industrial
Series β€” AVR ATmega ATmega325P
Interfaces β€” USART, SPI, JTAG
Instruction Set β€” 131 powerful instructions, most single-cycle
Package Code (JEDEC) β€” HVQCCN, square, no-lead
Package Body β€” 10 x 10 mm, 1 mm height, 0.80 mm pitch (legacy summary)
Lifecycle Stage β€” ACTIVE

Datasheets & Resources

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