ATSAMA5D26B-CNR vs ATSAMA5D22B-CNR Comparison

Detailed side-by-side comparison of ATSAMA5D26B-CNR by Microchip Technology and ATSAMA5D22B-CNR by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
ATSAMA5D26B-CNR ATSAMA5D26B-CNR - 500MHz Cortex-A5 MPU, 289-LFBGA | Microchip

ATSAMA5D26B-CNR - 500MHz Cortex-A5 MPU, 289-LFBGA | Microchip

ATSAMA5D26B-CNR ✓ Active
Microchip Technology
ATSAMA5D22B-CNR ATSAMA5D22B-CNR - 500MHz Cortex-A5 MPU 196-TFBGA | Microchip

ATSAMA5D22B-CNR - 500MHz Cortex-A5 MPU 196-TFBGA | Microchip

ATSAMA5D22B-CNR ✓ Active

Specification Comparison

Parameter ATSAMA5D26B-CNR ATSAMA5D22B-CNR
Brand Microchip Technology Microchip Technology
Category Microcontrollers Microcontrollers
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $9.10 $7.21
Core Architecture Arm Cortex-A5 (Armv7-A) with NEON and FPU —
Maximum Core Frequency 500 MHz —
Core Count 1 1
Internal SRAM 128 KB —
External Memory Support DDR2/DDR3L/LPDDR2/LPDDR3, QSPI, e.MMC, NAND —
Package 289-LFBGA (14x14x1.4 mm) 196-TFBGA (11x11x1.2 mm)
Ball Pitch 0.8 mm 0.8 mm
Graphics Controller 2D LCD controller, up to 2048x2048 —
Ethernet 2x EMAC with IEEE 1588 (10/100 Mbps) —
USB USB 2.0 High-Speed Host and Device —
Serial Interfaces 6x FLEXCOM (USART/SPI/TWI), 2x CAN-FD —
Audio Embedded audio subsystem (SSC, I2S) —
Security Crypto accelerator, secure boot, tamper detection, TRNG —
Operating Temperature -40C to +85C (Industrial) -40C to +105C (extended)
Mounting Type Surface Mount (BGA) Surface Mount
MSL Level 3 —
RoHS Status Compliant Compliant
Architecture — ARM Cortex-A5 (ARMv7-A)
Data Width — 32-bit
Maximum Clock Frequency — 500 MHz
Core Supply Voltage — 1.2 V
L1 Instruction Cache — 32 KB
L1 Data Cache — 32 KB
L2 Cache — 128 KB (configurable as SRAM)
NEON Media Processing Engine — Yes
Floating Point Unit — Yes
ARM TrustZone — Yes
Peripheral Touch Controller (PTC) — Yes
Embedded Audio Subsystem — Yes (I2S/TDM)
Packaging — Tape & Reel (T&R)

Datasheets & Resources

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