ATSAMA5D27C-D5M-CU vs ATSAMA5D27C-D1G-CU Comparison

Detailed side-by-side comparison of ATSAMA5D27C-D5M-CU by Microchip Technology and ATSAMA5D27C-D1G-CU by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
ATSAMA5D27C-D5M-CU ATSAMA5D27C-D5M-CU - 500MHz Cortex-A5 MPU, 512Mb DDR2 SiP | Microchip

ATSAMA5D27C-D5M-CU - 500MHz Cortex-A5 MPU, 512Mb DDR2 SiP | Microchip

ATSAMA5D27C-D5M-CU ✓ Active
Microchip Technology
ATSAMA5D27C-D1G-CU ATSAMA5D27C-D1G-CU - Cortex-A5 MPU 500MHz 1Gbit DDR2 | Microchip

ATSAMA5D27C-D1G-CU - Cortex-A5 MPU 500MHz 1Gbit DDR2 | Microchip

ATSAMA5D27C-D1G-CU ✓ Active

Specification Comparison

Parameter ATSAMA5D27C-D5M-CU ATSAMA5D27C-D1G-CU
Brand Microchip Technology Microchip Technology
Category Microcontrollers Microcontrollers
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $18.40 $19.10
Part Status Active —
Core Processor ARM Cortex-A5 —
Number of Cores / Bus Width 1 Core, 32-Bit —
Speed 500 MHz —
Co-Processors / DSP ARM NEON, FPU —
RAM Controllers DDR2/LPDDR2 (integrated 512 Mbit DDR2 SiP) —
Graphics Acceleration Yes (2D) —
Peripheral Touch Controller Yes (16-bit databus) —
Audio Subsystem I2S, class-D amplifier interface —
Ethernet Dual 10/100 GMAC with 1588 PTP 10/100 Mbps (1x EMAC, external PHY)
USB USB HSIC + 2x USB 2.0 High-Speed USB 2.0 High-Speed with HSIC
CAN 2x CAN-FD —
Serial Interfaces 3x FLEXCOM (USART/SPI/TWI), 2x SD/MMC, 1x I2C, 1x SPI, 1x UART —
Image Sensor Interface Yes —
Operating Temperature -40°C to +85°C (Industrial) Industrial (-40C to +85C)
Package / Case 289-LFBGA (14x14 mm, 0.8 mm ball pitch) —
Mounting Type Surface Mount Surface Mount (BGA)
RoHS Status Compliant Compliant (Green, BGA GREEN)
Core Architecture — ARM Cortex-A5 (ARMv7-A)
Core Count — 1
Maximum CPU Clock — 500 MHz
Bit Width — 32-bit
Integrated Memory — 1 Gbit DDR2 SDRAM (16-bit data bus)
Supply Voltage — 3.3 V I/O
Core Voltage — 1.2 V
Package — 289-TFBGA (14x14 mm), 0.8 mm ball pitch
Packaging — Tray
Series — SAMA5D2 SiP

Datasheets & Resources

Browse All Products Create BOM Request Quote