ATSAME70Q19A-CN vs ATSAME70Q19B-CN Comparison

Detailed side-by-side comparison of ATSAME70Q19A-CN by Microchip Technology and ATSAME70Q19B-CN by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
ATSAME70Q19A-CN ATSAME70Q19A-CN - 300MHz Cortex-M7 MCU 512KB Flash LFBGA-144 | Microchip

ATSAME70Q19A-CN - 300MHz Cortex-M7 MCU 512KB Flash LFBGA-144 | Microchip

ATSAME70Q19A-CN ✓ Active
Microchip Technology
ATSAME70Q19B-CN ATSAME70Q19B-CN - 300MHz Cortex-M7 MCU 512KB Flash | Microchip

ATSAME70Q19B-CN - 300MHz Cortex-M7 MCU 512KB Flash | Microchip

ATSAME70Q19B-CN ✓ Active

Specification Comparison

Parameter ATSAME70Q19A-CN ATSAME70Q19B-CN
Brand Microchip Technology Microchip Technology
Category Microcontrollers Microcontrollers
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $6.68 $11.95
Core Architecture ARM Cortex-M7 with FPU (single + double precision) ARM Cortex-M7 with FPU
Maximum CPU Clock 300 MHz —
Flash Memory 512 KB 512 KB (512K x 8)
SRAM 256 KB 256 KB
Operating Voltage (VDDCORE) 1.2 V (typical) —
I/O Voltage (VDDIO) 3.3 V (typical) —
Package 144-LFBGA (10x10 mm, 0.8 mm pitch) 144-LFBGA (10x10 mm)
Operating Temperature -40C to +105C (industrial) -40C to +85C (commercial)
ADC 12-bit, up to 2 Msps 12-bit
DAC 12-bit 12-bit
USB USB 2.0 High-Speed Host + Device with on-chip PHY High-Speed USB
Ethernet 10/100 Mbps MAC (GMAC) with 1588 PTP 10/100 MAC
CAN 2x CAN-FD controllers —
Serial Interfaces 3x FLEXCOM (USART/SPI/TWI), 2x I2S, 2x SPI high-speed —
DMA Channels 24 (XDMAC) —
Crypto Accelerator AES, SHA, TRNG hardware blocks —
External Bus Interface (EBI) Yes (SDRAM, SRAM, NAND support) —
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
MSL Level 3 3 (per JEDEC J-STD-020)
RoHS Status Compliant Compliant
Maximum Clock Frequency — 300 MHz
Operating Voltage (Core) — 1.2 V
CAN-FD — 2 controllers

Datasheets & Resources

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