ATSAME70Q19B-CN vs ATSAME70Q19A-CN Comparison

Detailed side-by-side comparison of ATSAME70Q19B-CN by Microchip Technology and ATSAME70Q19A-CN by Microchip Technology. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Microchip Technology
ATSAME70Q19B-CN ATSAME70Q19B-CN - 300MHz Cortex-M7 MCU 512KB Flash | Microchip

ATSAME70Q19B-CN - 300MHz Cortex-M7 MCU 512KB Flash | Microchip

ATSAME70Q19B-CN ✓ Active
Microchip Technology
ATSAME70Q19A-CN ATSAME70Q19A-CN - 300MHz Cortex-M7 MCU 512KB Flash LFBGA-144 | Microchip

ATSAME70Q19A-CN - 300MHz Cortex-M7 MCU 512KB Flash LFBGA-144 | Microchip

ATSAME70Q19A-CN ✓ Active

Specification Comparison

Parameter ATSAME70Q19B-CN ATSAME70Q19A-CN
Brand Microchip Technology Microchip Technology
Category Microcontrollers Microcontrollers
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $11.95 $6.68
Core Architecture ARM Cortex-M7 with FPU ARM Cortex-M7 with FPU (single + double precision)
Maximum Clock Frequency 300 MHz —
Flash Memory 512 KB (512K x 8) 512 KB
SRAM 256 KB 256 KB
Package 144-LFBGA (10x10 mm) 144-LFBGA (10x10 mm, 0.8 mm pitch)
Operating Voltage (Core) 1.2 V —
Operating Temperature -40C to +85C (commercial) -40C to +105C (industrial)
ADC 12-bit 12-bit, up to 2 Msps
DAC 12-bit 12-bit
CAN-FD 2 controllers —
USB High-Speed USB USB 2.0 High-Speed Host + Device with on-chip PHY
Ethernet 10/100 MAC 10/100 Mbps MAC (GMAC) with 1588 PTP
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
MSL Level 3 (per JEDEC J-STD-020) 3
RoHS Status Compliant Compliant
Maximum CPU Clock — 300 MHz
Operating Voltage (VDDCORE) — 1.2 V (typical)
I/O Voltage (VDDIO) — 3.3 V (typical)
CAN — 2x CAN-FD controllers
Serial Interfaces — 3x FLEXCOM (USART/SPI/TWI), 2x I2S, 2x SPI high-speed
DMA Channels — 24 (XDMAC)
Crypto Accelerator — AES, SHA, TRNG hardware blocks
External Bus Interface (EBI) — Yes (SDRAM, SRAM, NAND support)

Datasheets & Resources

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