BSC9131NSN1KHKB557 vs BSC9131NSN7KHKB Comparison

Detailed side-by-side comparison of BSC9131NSN1KHKB557 by NXP Semiconductors and BSC9131NSN7KHKB by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
BSC9131NSN1KHKB557 BSC9131NSN1KHKB557 - 800MHz 32-bit QorIQ Processor | NXP

BSC9131NSN1KHKB557 - 800MHz 32-bit QorIQ Processor | NXP

BSC9131NSN1KHKB557 ✓ Active
NXP Semiconductors
BSC9131NSN7KHKB BSC9131NSN7KHKB - 800MHz e500 SoC | NXP Semiconductors

BSC9131NSN7KHKB - 800MHz e500 SoC | NXP Semiconductors

BSC9131NSN7KHKB ✗ End of Life

Specification Comparison

Parameter BSC9131NSN1KHKB557 BSC9131NSN7KHKB
Brand NXP Semiconductors NXP Semiconductors
Category Microcontrollers Microcontrollers
Lifecycle Status Active End of Life
Product Type Embedded microprocessor QorIQ Qonverge network processor SoC
Processor Family QorIQ Qonverge BSC9131 —
Core Count 1 core 1 core
Word Size 32-bit 32-bit
Maximum Operating Frequency 800 MHz —
Core Technology Power e500 —
Additional Core Technology StarCore SC3850 —
DSP Acceleration MAPLE-B2F specialist DSP acceleration processing —
Package Type 520-FCBGA —
Package Dimensions 21 x 21 mm —
Ball Count 520 balls —
Mounting Type Surface mount Surface Mount
Primary Application Small-cell base stations —
Additional Applications Enterprise VoIP, smart-grid control, military and defense, industrial —
Device Category Microprocessor IC, MPU and DSP —
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
REACH Status [DATA_NEEDED: REACH status] [DATA_NEEDED: REACH status]
AEC-Q100 Status [DATA_NEEDED: AEC-Q100 qualification status] —
Lead-Free Status [DATA_NEEDED: lead-free status] [DATA_NEEDED: lead-free status]
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
General-Purpose CPU — PowerPC e500, 1 core, 32-bit
e500 Core Frequency — 800 MHz
DSP Processor — StarCore SC3850 at 1 GHz
Specialist Accelerator — MAPLE-B2F
Interface — IFC
External Memory Support — DDR3
Package — 520-FCBGA, 21 x 21 mm
Pin Count — 520 balls
Operating Temperature — 0 C to 105 C
Lifecycle Status — End of Life
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification status]
Halogen-Free Status — [DATA_NEEDED: halogen-free status]
Unit Price at Quantity 1 — [DATA_NEEDED: unit price]

Datasheets & Resources

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