BSC9131NXN7KHKB vs BSC9131NLE7HHHB Comparison

Detailed side-by-side comparison of BSC9131NXN7KHKB by NXP Semiconductors and BSC9131NLE7HHHB by NXP Semiconductors. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

NXP Semiconductors
BSC9131NXN7KHKB BSC9131NXN7KHKB - 1GHz QorIQ Qonverge SoC | NXP

BSC9131NXN7KHKB - 1GHz QorIQ Qonverge SoC | NXP

BSC9131NXN7KHKB ✗ End of Life
NXP Semiconductors
BSC9131NLE7HHHB BSC9131NLE7HHHB - 800MHz e500 SoC | NXP

BSC9131NLE7HHHB - 800MHz e500 SoC | NXP

BSC9131NLE7HHHB ✗ End of Life

Specification Comparison

Parameter BSC9131NXN7KHKB BSC9131NLE7HHHB
Brand NXP Semiconductors NXP Semiconductors
Category DSP Microcontrollers
Lifecycle Status End of Life End of Life
Product Type QorIQ Qonverge system-on-chip QorIQ Qonverge system-on-chip
CPU Core 1 x 32-bit Power e500 core —
CPU Frequency 1 GHz —
DSP Core StarCore SC3850 StarCore SC3850
DSP Frequency 1 GHz 800 MHz
Specialist Accelerator MAPLE-B2F MAPLE-B2F
External Memory Support DDR3 DDR3
Connectivity Interface IFC —
Package 520-FCBGA, 21 mm x 21 mm 520-FCBGA, 21 x 21 mm
Operating Temperature -40°C to +105°C 0°C to 105°C
Lifecycle Status End of Life —
Core Count 1 core —
Processor Architecture PowerPC e500 PowerPC e500
Product Series QorIQ Qonverge BSC —
Mounting Type Surface mount —
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
REACH Status [DATA_NEEDED: REACH status] [DATA_NEEDED: REACH status]
AEC-Q100 Qualification [DATA_NEEDED: AEC-Q100 qualification] [DATA_NEEDED: AEC-Q100 qualification]
Lead-Free Status [DATA_NEEDED: lead-free status] —
Thermal Resistance [DATA_NEEDED: theta JA and theta JC] —
Supply Voltage [DATA_NEEDED: core, I/O, and accelerator supply voltages] —
Pinout [DATA_NEEDED: complete 520-FCBGA ball assignment] —
General-Purpose Processor Core — 1 core
Processor Word Size — 32 bit
e500 Core Frequency — 800 MHz
Security Feature — SEC
Package Type — Flip-chip ball grid array
Number of Package Balls — 520 balls
Target Application 1 — Small-cell base station
Target Application 2 — Enterprise VoIP
Target Application 3 — Smart-grid control
Target Application 4 — Military and defense
Target Application 5 — Industrial applications

Datasheets & Resources

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