EP1C12F324C8 vs EP1C12F324C7 Comparison
Detailed side-by-side comparison of EP1C12F324C8 by Intel and EP1C12F324C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP1C12F324C8 | EP1C12F324C7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $21.50 | $40.26 |
| Series | Cyclone | — |
| Family | Cyclone I (EP1C12) | Cyclone |
| Manufacturer | Intel (formerly Altera) | — |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| Number of Logic Elements (LEs) | 12060 | — |
| Number of LABs/CLBs | 1206 | — |
| Total Embedded Memory | 239616 bits | — |
| Number of I/O Pins | 249 | — |
| Package | 324-FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 324-ball FineLine BGA (FBGA-324) |
| Core Voltage | 1.5 V | 1.5 V |
| I/O Voltage | Up to 3.3 V (LVTTL/LVCMOS/SSTL/LVDS/PCI) | — |
| Number of PLLs | 2 | 2 |
| Maximum Internal Clock Frequency | 275 MHz (C8 speed grade) | — |
| Speed Grade | C8 (commercial, slowest speed bin) | — |
| Operating Temperature | 0C to +85C (commercial) | Commercial (0C to +85C) |
| Configuration Method | SRAM-based, external configuration device (EPCS series) | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| RoHS Status | Compliant (per DigiKey listing) | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | Yes | — |
| Logic Elements (LEs) | — | 12,060 |
| Logic Array Blocks (LABs) | — | 1,206 |
| Total RAM Bits | — | 239,616 |
| Number of CLBs / LABs | — | 1,206 LABs (each with 10 LEs) |
| Number of Logic Cells / Gates | — | 12,060 cells (Cyclone Family) |
| User I/Os | — | 249 |
| Operating Frequency (max) | — | 320.1 MHz |
| Package Dimensions | — | 19 x 19 mm, 1.0 mm pitch |
| Configuration Mode | — | Passive Serial (PS) / Active Serial (AS) / JTAG |