EP1C12F324C8 vs EP1C12F324C8L Comparison
Detailed side-by-side comparison of EP1C12F324C8 by Intel and EP1C12F324C8L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP1C12F324C8 | EP1C12F324C8L |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $21.50 | $23.40 |
| Series | Cyclone | — |
| Family | Cyclone I (EP1C12) | Cyclone |
| Manufacturer | Intel (formerly Altera) | — |
| Process Technology | 130 nm CMOS | CMOS, 130 nm |
| Number of Logic Elements (LEs) | 12060 | — |
| Number of LABs/CLBs | 1206 | — |
| Total Embedded Memory | 239616 bits | — |
| Number of I/O Pins | 249 | — |
| Package | 324-FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | FBGA-324 |
| Core Voltage | 1.5 V | — |
| I/O Voltage | Up to 3.3 V (LVTTL/LVCMOS/SSTL/LVDS/PCI) | — |
| Number of PLLs | 2 | — |
| Maximum Internal Clock Frequency | 275 MHz (C8 speed grade) | — |
| Speed Grade | C8 (commercial, slowest speed bin) | 8 |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Configuration Method | SRAM-based, external configuration device (EPCS series) | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS Status | Compliant (per DigiKey listing) | Compliant |
| Lead-Free | Yes | — |
| Logic Elements | — | 12,060 |
| Embedded RAM Bits | — | 239,616 |
| M4K RAM Blocks | — | 52 |
| User I/O Pins | — | 249 |
| PLLs | — | 2 |
| Package Body Size | — | 19 x 19 mm |
| Ball Pitch | — | 1.0 mm |
| Core Voltage (VCCINT) | — | 1.5 V |
| I/O Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Power Variant | — | Low-power (L suffix) |
| MSL Level | — | [DATA_NEEDED: MSL level] |