EP1C12F324C8 vs EP1C20F324C6 Comparison
Detailed side-by-side comparison of EP1C12F324C8 by Intel and EP1C20F324C6 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP1C12F324C8 | EP1C20F324C6 |
|---|---|---|
| Brand | Intel | Altera |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | NRND |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $21.50 | $105.00 |
| Series | Cyclone | — |
| Family | Cyclone I (EP1C12) | Cyclone |
| Manufacturer | Intel (formerly Altera) | — |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| Number of Logic Elements (LEs) | 12060 | — |
| Number of LABs/CLBs | 1206 | — |
| Total Embedded Memory | 239616 bits | — |
| Number of I/O Pins | 249 | — |
| Package | 324-FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch | 324-ball FBGA (FineLine BGA) |
| Core Voltage | 1.5 V | — |
| I/O Voltage | Up to 3.3 V (LVTTL/LVCMOS/SSTL/LVDS/PCI) | — |
| Number of PLLs | 2 | — |
| Maximum Internal Clock Frequency | 275 MHz (C8 speed grade) | — |
| Speed Grade | C8 (commercial, slowest speed bin) | 6 |
| Operating Temperature | 0C to +85C (commercial) | — |
| Configuration Method | SRAM-based, external configuration device (EPCS series) | — |
| Mounting Type | Surface Mount (BGA) | — |
| RoHS Status | Compliant (per DigiKey listing) | — |
| Lead-Free | Yes | — |
| Logic Elements (LE) | — | 20,060 |
| Embedded RAM Bits | — | 294,912 bits (64 M4K blocks × 4,608 bits) |
| User I/O Count | — | 233 |
| Core Voltage (VCCINT) | — | 1.5 V |
| I/O Voltage Standards | — | LVCMOS / LVTTL (3.3 V, 2.5 V, 1.8 V, 1.5 V), LVDS |
| PLLs | — | 4 |
| Maximum Internal Frequency | — | 405.2 MHz |
| LVDS Data Rate (per pair) | — | Up to 640 Mbps |
| Memory Interfaces | — | DDR SDRAM, QDR SRAM, SDR SDRAM |
| Temperature Grade | — | Commercial (0 °C to +85 °C) |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG |