EP1C4F324C6 vs EP1C4F324C7 Comparison
Detailed side-by-side comparison of EP1C4F324C6 by Intel and EP1C4F324C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP1C4F324C6 | EP1C4F324C7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $16.75 | $46.80 |
| Manufacturer | Intel (formerly Altera) | — |
| Series | Cyclone | Cyclone |
| Logic Elements (LE) | 4,000 | — |
| Total RAM Bits | 78,336 | — |
| Maximum User I/O | 249 | 249 |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| PLLs | 2 | — |
| Process Technology | 130 nm | CMOS, 130 nm-class (Cyclone generation) |
| Core Voltage (VCCINT) | 1.5 V | — |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Maximum Internal Frequency | 405.2 MHz | — |
| Package Type | 324-ball FineLine BGA (FBGA) | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Operating Temperature | 0C to +85C (commercial, C6 suffix) | Commercial (0 °C to +85 °C) inferred from speed grade C7 |
| Configuration Method | Serial / JTAG | — |
| RoHS Status | Compliant | Compliant (lead-free FBGA) |
| Device Type | — | FPGA (Field-Programmable Gate Array) |
| Logic Elements | — | 4 000 |
| Logic Array Blocks / CLBs | — | 400 CLBs |
| Embedded Memory (Bits) | — | 78 336 |
| Package | — | 324-FBGA, 19 × 19 mm, 1.0 mm pitch, lead-free |
| Core Supply Voltage | — | 1.5 V |
| Internal Frequency (max, family ref) | — | 405 MHz |
| Configuration Modes | — | Passive Serial (PS), Active Serial (AS), JTAG |
| MSL Level | — | 3 (per JEDEC J-STD-020, typical for BGA-324) |