EP20K400EFC672-1 vs EP20K400FI672-1XN Comparison
Detailed side-by-side comparison of EP20K400EFC672-1 by Intel and EP20K400FI672-1XN by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP20K400EFC672-1 | EP20K400FI672-1XN |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | NRND |
| Family | APEX 20KE | APEX 20K |
| System Gates | 400,000 | — |
| Logic Elements / Cells | 16,640 | — |
| Maximum User I/O | 488 | — |
| Embedded Memory | 212,992 bits | — |
| Core Voltage | 1.8 V | — |
| I/O Voltage Tolerance | 2.5 V / 3.3 V compatible | — |
| Technology | 0.22 um CMOS | — |
| Propagation Delay | 2.5 ns | — |
| Internal Operating Frequency | 368 MHz | — |
| Speed Grade | -1 | -1 |
| Package | 672-FBGA (FineLine BGA) | 672-ball FineLine BGA (FI672) |
| Mounting Type | Surface Mount | — |
| Operating Temperature | 0C to +85C (Commercial) | -40 C to +85 C (industrial) |
| Logic Family | CMOS | — |
| Architecture | MultiCore (LUT + EAB + product-term) | — |
| Device | — | EP20K400 |
| Typical Gates | — | 400,000 |
| Logic Elements | — | 16,640 |
| Maximum User I/O Pins | — | 488 |
| Embedded System Memory | — | 212 Kbit |
| Number of PLLs | — | 4 |
| Core Supply Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | — | 2.5 V / 3.3 V |
| Process Technology | — | 0.18 micrometer CMOS |
| Package Size | — | 27 mm x 27 mm |
| Configuration Method | — | SRAM, JTAG, EPC serial PROM |
| JTAG Support | — | IEEE 1149.1 boundary-scan compliant |
| RoHS Status | — | [DATA_NEEDED: RoHS status] |
| MSL Level | — | 3 |