EP20K400FI672-2X vs EP20K400EFI672-2X Comparison
Detailed side-by-side comparison of EP20K400FI672-2X by Intel and EP20K400EFI672-2X by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP20K400FI672-2X | EP20K400EFI672-2X |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | NRND |
| Family | APEX 20K | APEX 20KE |
| Logic Elements | 16,640 | 16,640 |
| Typical Gates | 400,000 system gates | — |
| Embedded Memory | 212,992 bits | 212,992 bits |
| User I/O Pins | 496 | — |
| Package | 672-ball BGA (FI672) | 672-ball FineLine BGA (FC-FBGA), 27 × 27 mm |
| Package Code | BGA | — |
| Terminal Form | Ball | — |
| No. of Terminals | 672 | — |
| Package Shape | Square | — |
| Speed Grade | -2X | — |
| Operating Temperature | -40C to +85C (industrial) | 0 °C to 85 °C (Industrial) |
| Core Voltage | 1.8 V | — |
| I/O Voltage Support | 1.8V / 2.5V / 3.3V / 5V (MultiVolt) | — |
| Configuration Method | SRAM (serial EPROM or JTAG) | — |
| JTAG Support | Yes (IEEE 1149.1) | — |
| Process Technology | 0.18 um CMOS, 6-metal | 0.22 µm CMOS |
| RoHS Status | [DATA_NEEDED: RoHS compliance] | Compliant |
| Series | — | EP20K400E |
| System Gates | — | 400,000 |
| Maximum User I/O | — | 488 |
| Number of I/O Banks | — | 8 |
| PLLs | — | 4 |
| Core Voltage (VCCINT) | — | 1.71 V to 1.89 V (1.8 V nominal) |
| Maximum Internal Frequency | — | 223 MHz |
| Ball Pitch | — | 1.27 mm |
| Mounting Type | — | Surface Mount |
| Moisture Sensitivity Level (MSL) | — | 3 |
| Peak Reflow Temperature | — | 220 °C |
| Halogen Free | — | Compliant |