EP20K600CF672-1X vs EP20K600CF672C9 Comparison

Detailed side-by-side comparison of EP20K600CF672-1X by Intel and EP20K600CF672C9 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP20K600CF672-1X EP20K600CF672C9
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND NRND
Series APEX 20KC —
Device Family APEX 20KC MultiCore FPGA APEX 20KC
Maximum Typical Gates 600,000 —
Logic Elements 31,104 (per Altera APEX 20KC datasheet family) —
Embedded System Blocks (ESBs) up to 256 —
Embedded Memory (max bits) [DATA_NEEDED: ESB RAM bits] —
PLLs 4 —
Maximum User I/O [DATA_NEEDED: max user I/O count] 488 pins
Package 672-ball BGA (CF672), 1.27 mm pitch —
Speed Grade -1 (industrial speed grade, X = lead-free) —
Process Technology 0.18 um SRAM CMOS 0.15 µm all-layer copper-metal
Configuration Method SRAM, JTAG (IEEE 1149.1), EPC passive serial —
Supply Voltage [DATA_NEEDED: VCCINT/VCCIO] —
Operating Temperature [DATA_NEEDED: industrial temp range] 0 °C to +85 °C (commercial)
Mounting Type Surface Mount (BGA) —
MSL Level [DATA_NEEDED: MSL rating] —
RoHS Status Compliant (per Alibaba distributor listing: "RoHS Compliant") [DATA_NEEDED: RoHS status]
Typical Gate Count — 600,000 gates
Logic Elements (LEs) — 24,320
Embedded Memory (EAB) — 311 Kbits
Propagation Delay — 1.48 ns
Maximum Internal Frequency — 250 MHz
Core Voltage — 1.8 V
Package Type — 672-pin FC-FBGA
Package Dimensions — 45 x 45 mm, 1.27 mm pitch
Total Pin Count — 652 balls
Configuration Interface — IEEE 1149.1 JTAG / passive serial / EPC configuration

Datasheets & Resources

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