EP20K600CF672I8N vs EP20K600CF672I7N Comparison

Detailed side-by-side comparison of EP20K600CF672I8N by Intel and EP20K600CF672I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP20K600CF672I8N EP20K600CF672I7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $138.00 $232.00
Device Family APEX 20KC β€”
Device Type SPLD / PLD (FPGA-class) β€”
System Gates 600K β€”
Logic Elements / Cells 24,320 β€”
Maximum User I/O (digchip) 488 β€”
Maximum User I/O (Altera) 508 β€”
Total Package Pins 672 β€”
Package Type FC-FBGA (Fine-pitch Chip-Scale BGA), 45 x 45 mm, 1.27 mm pitch β€”
Internal Performance 301.21 MHz β€”
Propagation Delay 1.48 ns β€”
Core Supply Voltage 1.8 V β€”
Process Technology 0.15-um all-layer copper-metal β€”
Operating Temperature 0C to 85C (Industrial) β€”
Pin-Compatible With APEX 20KE family β€”
RoHS Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS compliance]
Family β€” APEX 20KC
Technology β€” 0.15 Β΅m CMOS
Maximum System Gates β€” 600,000
Logic Elements β€” 24,320
Maximum User I/O Pins β€” 508
Maximum Internal Frequency β€” 376 MHz
Embedded System Blocks (ESBs) β€” 160
Total Embedded RAM (max) β€” 311,296 bits
Core Voltage (VCCINT) β€” 1.8 V
I/O Voltage (VCCIO) β€” 2.5 V / 3.3 V (MultiVolt, bank-dependent)
Package β€” 672-ball FineLine BGA (FC-FBGA)
Ball Pitch β€” 1.0 mm
Package Body Size β€” 27 mm Γ— 27 mm
Speed Grade β€” I7 (-40 Β°C to +100 Β°C industrial)
Propagation Delay (typical) β€” 1.6 ns
Configuration Method β€” JTAG (IEEE 1149.1) + EPC configuration device
Lead-Free Finish (N suffix) β€” Yes

Datasheets & Resources

Browse All Products Create BOM Request Quote