EP2A40F33C-7 vs EP2A40F33I-7 Comparison
Detailed side-by-side comparison of EP2A40F33C-7 by Altera and EP2A40F33I-7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2A40F33C-7 | EP2A40F33I-7 |
|---|---|---|
| Brand | Altera | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | APEX II | — |
| Logic Elements | 40,960 LEs | [DATA_NEEDED: logic element count] |
| Typical Gates | 1,500,000 system gates | — |
| Embedded Memory | 342 Kbits dual-port RAM | — |
| Speed Grade | -7 | — |
| Package | 33 mm FineLine BGA (F33) | — |
| Maximum User I/O | [DATA_NEEDED: user I/O count] | — |
| Core Voltage | 1.5 V | — |
| I/O Voltage Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-bank) | — |
| Process Technology | 0.15 µm CMOS | Altera APEX II CMOS programmable logic |
| PLLs | Up to 4 | — |
| Operating Temperature | Commercial (0 °C to +85 °C) | — |
| Moisture Sensitivity Level | MSL 3 | — |
| Peak Reflow Temperature | 220 °C | 220 C (Pb-free profile) |
| Design Software | Quartus II (legacy) | — |
| Configuration Method | Passive serial / parallel / JTAG | JTAG / serial configuration flash |
| Device Family | — | APEX II (EP2A) |
| Device Member | — | EP2A40 (high-density) |
| Package Type | — | Fine-pitch BGA (FBGA) |
| Package Pin/Ball Count | — | 33 balls |
| Pitch | — | [DATA_NEEDED: ball pitch] |
| Operating Temperature Grade | — | Industrial (-40 C to +85 C) |
| Moisture Sensitivity Level (MSL) | — | 3 (per JEDEC J-STD-020) |
| Floor Life at MSL3 | — | 168 hours (factory conditions < 30 C / 60% RH) |
| Design Tool | — | Altera Quartus |
| RoHS Status | — | [DATA_NEEDED: RoHS compliance per PCN] |
| Lead-Free Reflow Compatible | — | Yes (peak 220 C) |
| Voltage Supply | — | [DATA_NEEDED: VCCINT / VCCIO] |
| Mounting Type | — | Surface Mount |