EP2A40F33I-7 vs EP2A40F33I-8 Comparison

Detailed side-by-side comparison of EP2A40F33I-7 by Intel and EP2A40F33I-8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2A40F33I-7 EP2A40F33I-8
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Device Family APEX II (EP2A) —
Device Member EP2A40 (high-density) —
Logic Elements [DATA_NEEDED: logic element count] —
Package Type Fine-pitch BGA (FBGA) —
Package Pin/Ball Count 33 balls —
Pitch [DATA_NEEDED: ball pitch] —
Operating Temperature Grade Industrial (-40 C to +85 C) —
Peak Reflow Temperature 220 C (Pb-free profile) 220 °C
Moisture Sensitivity Level (MSL) 3 (per JEDEC J-STD-020) —
Floor Life at MSL3 168 hours (factory conditions < 30 C / 60% RH) —
Configuration Method JTAG / serial configuration flash SRAM (volatile) - external PROM required
Design Tool Altera Quartus —
RoHS Status [DATA_NEEDED: RoHS compliance per PCN] [DATA_NEEDED: RoHS status]
Lead-Free Reflow Compatible Yes (peak 220 C) —
Process Technology Altera APEX II CMOS programmable logic —
Voltage Supply [DATA_NEEDED: VCCINT / VCCIO] —
Mounting Type Surface Mount —
Family — APEX II
Manufacturer — Intel (formerly Altera)
Device Type — FPGA (Field-Programmable Gate Array)
Typical Gates — 1,500,000
Logic Elements (LEs) — 40,960
Embedded System Memory — 425,984 bits
Maximum User I/O — 672
Package — 672-ball FineLine BGA (F33)
Speed Grade — -8
Temperature Grade — Industrial (-40 °C to +85 °C)
PLLs — 4
High-Speed Clock Pins — 16
Moisture Sensitivity Level — MSL 3

Datasheets & Resources

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