EP2A40F33I-8 vs EP2A40F33C-9 Comparison
Detailed side-by-side comparison of EP2A40F33I-8 by Intel and EP2A40F33C-9 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2A40F33I-8 | EP2A40F33C-9 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | NRND |
| Family | APEX II | APEX II |
| Manufacturer | Intel (formerly Altera) | — |
| Device Type | FPGA (Field-Programmable Gate Array) | — |
| Typical Gates | 1,500,000 | — |
| Logic Elements (LEs) | 40,960 | — |
| Embedded System Memory | 425,984 bits | — |
| Maximum User I/O | 672 | [DATA_NEEDED: max user I/O count] |
| Package | 672-ball FineLine BGA (F33) | 672-ball FineLine BGA (F33), 1.27 mm pitch |
| Speed Grade | -8 | -9 |
| Temperature Grade | Industrial (-40 °C to +85 °C) | — |
| PLLs | 4 | 4 |
| High-Speed Clock Pins | 16 | — |
| Configuration Method | SRAM (volatile) - external PROM required | JTAG, serial PROM, parallel flash |
| Moisture Sensitivity Level | MSL 3 | — |
| Peak Reflow Temperature | 220 °C | 220 C |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: not stated in provided data] |
| Maximum System Gates | — | 1,600,000 |
| Embedded RAM | — | 65 Kbytes (approximately 540 Kbits depending on configuration) |
| Operating Temperature | — | 0C to +85C (commercial) |
| Process Technology | — | 0.15 micrometer CMOS |
| LVDS Channels | — | 16 high-speed LVDS channels |
| Logic Elements | — | [DATA_NEEDED: exact LE count] |
| Multi-Core Architecture | — | MegaLAB structure with embedded memory and CAM |
| MSL Level | — | 3 |
| Core Voltage | — | [DATA_NEEDED: nominal core voltage] |
| Mounting Type | — | Surface Mount (BGA) |