EP2A40F33I-8 vs EP2A40F33I-7 Comparison
Detailed side-by-side comparison of EP2A40F33I-8 by Intel and EP2A40F33I-7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2A40F33I-8 | EP2A40F33I-7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | APEX II | — |
| Manufacturer | Intel (formerly Altera) | — |
| Device Type | FPGA (Field-Programmable Gate Array) | — |
| Typical Gates | 1,500,000 | — |
| Logic Elements (LEs) | 40,960 | — |
| Embedded System Memory | 425,984 bits | — |
| Maximum User I/O | 672 | — |
| Package | 672-ball FineLine BGA (F33) | — |
| Speed Grade | -8 | — |
| Temperature Grade | Industrial (-40 °C to +85 °C) | — |
| PLLs | 4 | — |
| High-Speed Clock Pins | 16 | — |
| Configuration Method | SRAM (volatile) - external PROM required | JTAG / serial configuration flash |
| Moisture Sensitivity Level | MSL 3 | — |
| Peak Reflow Temperature | 220 °C | 220 C (Pb-free profile) |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance per PCN] |
| Device Family | — | APEX II (EP2A) |
| Device Member | — | EP2A40 (high-density) |
| Logic Elements | — | [DATA_NEEDED: logic element count] |
| Package Type | — | Fine-pitch BGA (FBGA) |
| Package Pin/Ball Count | — | 33 balls |
| Pitch | — | [DATA_NEEDED: ball pitch] |
| Operating Temperature Grade | — | Industrial (-40 C to +85 C) |
| Moisture Sensitivity Level (MSL) | — | 3 (per JEDEC J-STD-020) |
| Floor Life at MSL3 | — | 168 hours (factory conditions < 30 C / 60% RH) |
| Design Tool | — | Altera Quartus |
| Lead-Free Reflow Compatible | — | Yes (peak 220 C) |
| Process Technology | — | Altera APEX II CMOS programmable logic |
| Voltage Supply | — | [DATA_NEEDED: VCCINT / VCCIO] |
| Mounting Type | — | Surface Mount |