EP2A40F672C8 vs EP2A40F672I-9 Comparison
Detailed side-by-side comparison of EP2A40F672C8 by Intel and EP2A40F672I-9 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2A40F672C8 | EP2A40F672I-9 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | APEX II | APEX II |
| Logic Family | CMOS | — |
| Typical Logic Elements (LEs) | 40,000 | — |
| Embedded Memory | Up to 1.5 Mbits | Dual-port RAM, single-port RAM, ROM, CAM (via ESBs) |
| User I/Os | 492 pins | — |
| Number of Pins | 672 | — |
| Package Type | FineLine BGA, 27 x 27 mm, 1.0 mm pitch | — |
| Process Technology | 0.15-micron all-layer copper, up to 8 metal layers | 0.15 µm CMOS |
| Propagation Delay (speed grade C8) | 1.55 ns | — |
| Operating Temperature | 0 C to 85 C (commercial) | -40 °C to +100 °C (Industrial) |
| Phase-Locked Loops (PLLs) | 4 | — |
| LVDS Signaling Support | Up to 1 Gbps | — |
| Multipliers | Embedded multiplier blocks | — |
| I/O Standards | LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS | — |
| Mounting Type | Surface Mount (BGA) | — |
| Device | — | EP2A40 |
| Logic Elements | — | 38,400 |
| System Gates | — | 1,500,000 |
| Maximum Operating Frequency | — | 366 MHz |
| Core Voltage (VCCINT) | — | 1.5 V |
| I/O Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (banked) |
| Package | — | 672-pin FC-FBGA (Fine-pitch Ball Grid Array) |
| Speed Grade | — | -9 |
| True-LVDS Channels | — | Yes (dedicated) |
| Hot Socketing | — | Supported |
| Configuration Mode | — | Passive serial, passive parallel synchronous, passive parallel asynchronous, JTAG |
| Moisture Sensitivity Level | — | MSL 3 |
| Peak Reflow Temperature | — | 220 °C |
| RoHS Status | — | [DATA_NEEDED: RoHS status] |