EP2A40F672C8N vs EP2A40F672I-8 Comparison
Detailed side-by-side comparison of EP2A40F672C8N by Intel and EP2A40F672I-8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2A40F672C8N | EP2A40F672I-8 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | APEX II | APEX II |
| Series | EP2A40 | APEX II (EP2A) |
| Logic Family | CMOS | — |
| System Gates | 1.5 M | — |
| Logic Elements / Cells | 38,400 | 38,400 |
| Maximum Operating Frequency | 376 MHz | — |
| Propagation Delay | 1.55 ns | — |
| Technology Node | 0.15 µm | — |
| Process Feature | All-layer copper, up to 8 metal layers | — |
| Nominal Supply Voltage (VCCINT) | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | — |
| User I/Os | 492 | — |
| Number of Pins / Balls | 672 | — |
| Package Type | FC-FBGA (FineLine BGA) | — |
| Package Dimensions | 27 x 27 mm | — |
| Ball Pitch | 1.0 mm | — |
| LVDS Data Rate | 1 Gbps | — |
| Embedded PLLs | 4 | — |
| Programming Interface | JTAG (IEEE 1149.1) | — |
| Operating Temperature (Commercial) | 0 °C to 85 °C | — |
| Speed Grade | C8 | -8 |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance] |
| Typical Gates | — | 1.5 M |
| Process Technology | — | 0.15 µm |
| Core Voltage | — | 1.5 V |
| Maximum Internal Frequency | — | 376 MHz |
| Package | — | 672-pin FC-FBGA |
| Mounting Type | — | Surface Mount |
| Operating Temperature | — | -40 °C to +100 °C (Industrial) |
| Peak Reflow Temperature | — | 220 °C |
| Moisture Sensitivity Level (MSL) | — | 3 |
| Memory Type | — | SRAM-based configuration |
| On-chip Memory | — | [DATA_NEEDED: embedded memory size] |
| Multipliers | — | [DATA_NEEDED: embedded multiplier count] |
| I/O Standard Support | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |