EP2A40F672I9 vs EP2A40F672I-9 Comparison

Detailed side-by-side comparison of EP2A40F672I9 by Intel and EP2A40F672I-9 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2A40F672I9 EP2A40F672I-9
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family APEX II APEX II
Logic Elements / Cells 38,400 cells —
System Gates 1.5 M 1,500,000
Process Technology 0.15 µm CMOS 0.15 µm CMOS
Maximum Internal Frequency 366 MHz —
Core Supply Voltage 1.5 V —
Package 672-pin FC-FBGA 672-pin FC-FBGA (Fine-pitch Ball Grid Array)
Mounting Type Surface Mount (BGA) —
Operating Temperature Grade Industrial (I) —
Programming Interface IEEE 1149.1 JTAG —
Configuration Memory SRAM-based, in-system programmable —
Design Tool Support Quartus / MAX+PLUS II —
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Lead-Free [DATA_NEEDED: lead-free status] —
Device Marking Suffix Decode I = Industrial grade; 9 = speed grade 9 —
Device — EP2A40
Logic Elements — 38,400
Maximum Operating Frequency — 366 MHz
Core Voltage (VCCINT) — 1.5 V
I/O Voltage (VCCIO) — 1.5 V / 1.8 V / 2.5 V / 3.3 V (banked)
Operating Temperature — -40 °C to +100 °C (Industrial)
Speed Grade — -9
True-LVDS Channels — Yes (dedicated)
Embedded Memory — Dual-port RAM, single-port RAM, ROM, CAM (via ESBs)
Hot Socketing — Supported
Configuration Mode — Passive serial, passive parallel synchronous, passive parallel asynchronous, JTAG
Moisture Sensitivity Level — MSL 3
Peak Reflow Temperature — 220 °C

Datasheets & Resources

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