EP2A70B724I-8 vs EP2A70B724C9N Comparison

Detailed side-by-side comparison of EP2A70B724I-8 by Altera and EP2A70B724C9N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2A70B724I-8 EP2A70B724C9N
Brand Altera Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete NRND
Family APEX II APEX II
Logic Elements / Cells 67,200 cells —
System Gates 3,000,000 3,000,000
Maximum Internal Frequency 281 MHz 198 MHz
Process Technology 0.15 µm CMOS 0.15 µm CMOS
Core Supply Voltage 1.5 V —
I/O Supply Voltage 3.3 V —
Number of Pins 724 —
Package Type FCBGA (Flip-Chip Ball Grid Array) —
Operating Temperature -40 °C to +100 °C (Industrial) [DATA_NEEDED: operating temperature grade]
Peak Reflow Temperature 220 °C (per JEDEC J-STD-020) —
User I/O Banks [DATA_NEEDED: user I/O bank count] —
User I/O Pins [DATA_NEEDED: user I/O pin count] 536
Embedded System Blocks (ESBs) [DATA_NEEDED: ESB count] —
Embedded Array Blocks (EABs) [DATA_NEEDED: EAB count] —
Embedded RAM [DATA_NEEDED: total bits] —
PLLs [DATA_NEEDED: PLL count] 4
Configuration Method JTAG / Passive Serial / Passive Parallel —
Mounting Type Surface Mount Surface Mount (BGA)
MSL Level [DATA_NEEDED: MSL level] —
RoHS Status [DATA_NEEDED: RoHS compliance] [DATA_NEEDED: RoHS compliance]
Series — EP2A70
Device Logic Elements — 67,200 cells
Core Voltage (VCCINT) — 1.5 V nominal (1.425 V – 1.575 V)
Package — 724-pin FCBGA
Propagation Delay — 2.87 ns
Embedded Memory (ESBs) — [DATA_NEEDED: embedded memory block count]
I/O Standards — LVDS, LVTTL, LVCMOS, PCI, GTL+ (per APEX II datasheet)

Datasheets & Resources

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