EP2A70F1508I9 vs EP2A70F1508I-8 Comparison
Detailed side-by-side comparison of EP2A70F1508I9 by Intel and EP2A70F1508I-8 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2A70F1508I9 | EP2A70F1508I-8 |
|---|---|---|
| Brand | Intel | Altera |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | NRND |
| Family | APEX II | — |
| Series | EP2A | APEX II (EP2A) |
| Logic Elements / Cells | 67200 | — |
| Total System Gates | 3 M | — |
| Maximum Internal Clock Frequency | 198 MHz | — |
| Process Technology | 0.15 µm | — |
| Core Supply Voltage (VCCINT) | 1.5 V | — |
| Number of Pins | 1508 | — |
| Package Type | FC-FBGA (Flip-Chip Fine-pitch Ball Grid Array) | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial (I) | — |
| Speed Grade | 9 (highest within APEX II family) | -8 |
| Embedded System Blocks (ESB) | Yes (dual-port RAM, FIFO, CAM) | — |
| PLL Count | Multiple (per datasheet) | — |
| Configuration Modes | PPS, PPA, PS, JTAG (IEEE 1149.1) | PS, PPS, PPA, JTAG |
| RoHS Status | unknown | [DATA_NEEDED: RoHS compliance status] |
| Logic Elements | — | 70,000 (approx.) |
| Package | — | 1508-ball FineLine BGA (FBGA-1508) |
| Operating Temperature | — | -40C to +100C (Industrial) |
| Configuration Memory | — | SRAM-based |
| I/O Standards Supported | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL, PCI |
| Embedded System Blocks (ESBs) | — | Yes (RAM/ROM/CAM) |
| On-chip PLLs | — | Yes |
| Supply Voltage | — | 1.8 V core (typical APEX II) |
| MSL Level | — | 3 |
| Peak Reflow Temperature | — | 220 C |
| Lead-free | — | [DATA_NEEDED: lead-free status] |
| MultiCore Interconnect | — | Yes |
| Design Software | — | Quartus II (APEX II support up to v13.0) |