EP2AGZ300FF35C3G vs EP2AGZ225FF35C3G Comparison

Detailed side-by-side comparison of EP2AGZ300FF35C3G by Intel and EP2AGZ225FF35C3G by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2AGZ300FF35C3G EP2AGZ225FF35C3G
Brand Intel Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Series Arria II GZ Arria II
Logic Elements 300,000 —
Adaptive Logic Modules (ALMs) 119,088 —
Embedded Memory 17,133 Kbit [DATA_NEEDED: Mbits]
DSP Blocks 16-bit x 18-bit x 18-bit multipliers, integer/fractional modes [DATA_NEEDED: count]
Transceivers 16 channels, up to 6.375 Gbps Up to 16 channels
Hard PCIe Controllers Up to 12 (Gen2 endpoint/root-port) —
User I/Os 1,288 —
I/O Banks 12 —
Process Technology 40 nm TSMC 40 nm TSMC
Package FCBGA-1152 (35 mm) 1152-ball Flip-Chip BGA (FF35)
Package Family BGA (Flip-Chip) —
Temperature Grade Commercial (0 C to 85 C junction) —
Speed Grade 3 (mid-performance) C3
Configuration Method Quartus II/Prime, JTAG, Passive Serial, Fast Passive Parallel —
Hard Memory Controller DDR3 up to 800 MHz, DDR2, QDR II+ —
RoHS Status Compliant Compliant
Family — Arria II GZ
Logic Elements (LE) — 225,000
Package Size — 35 mm x 35 mm
Operating Temperature — 0C to +85C (Commercial)
Transceiver Data Rate (max) — 6.375 Gbps
User I/O Banks — [DATA_NEEDED: count]
Maximum User I/O — [DATA_NEEDED: pin count]
Memory Controller Support — DDR3, DDR2, QDR II+
PCI Express Hard IP — Yes (Gen1/Gen2)
Mounting Type — Surface Mount (BGA)
MSL Level — 3 (per JEDEC J-STD-020)
Lead-Free — Yes

Datasheets & Resources

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