EP2C35F484C7N vs EP2C35F484I6N Comparison

Detailed side-by-side comparison of EP2C35F484C7N by Intel and EP2C35F484I6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2C35F484C7N EP2C35F484I6N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $85.20 $52.10
Family Cyclone II β€”
Logic Elements (LEs) 33,216 β€”
Total Memory Bits 483,840 bits β€”
Embedded Memory (M4K blocks) 105 β€”
Embedded 18x18 Multipliers 35 35 (Cyclone II family maximum 150)
User I/O Pins 322 β€”
Package 484-ball FBGA (FineLine BGA) 484-ball FBGA (Fine-Pitch BGA)
Process Technology 90 nm CMOS, SRAM-based β€”
Core Voltage (VCCINT) 1.2 V β€”
I/O Bank Voltage (VCCIO) 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) β€”
PLL Count 4 β€”
Global Clock Networks 16 β€”
Maximum User Frequency 402 MHz (internal logic) β€”
Configuration Modes JTAG, Active Serial (AS), Passive Serial (PS), PPA β€”
Operating Temperature 0C to +85C (commercial, 'C7' suffix) β€”
RoHS Status Compliant (lead-free) Compliant
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
Logic Elements β€” 33,216
Logic Array Blocks (LABs) β€” 2,100
Total RAM Bits β€” 483,840 bits (483.84 Kbit on-chip)
Phase-Locked Loops (PLLs) β€” 4
Maximum User I/O Pins β€” 322 (package-dependent; FBGA-484 supports up to 322 user I/O)
Logic Family β€” CMOS
Core Supply Voltage β€” 1.2 V
Operating Temperature Range β€” -40C to +85C (industrial)
Maximum Internal Clock Frequency β€” 402.5 MHz
Process Node β€” 90 nm TSMC CMOS
Configuration Method β€” Serial / Parallel (via Altera/Intel configuration device or JTAG)

Datasheets & Resources

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