EP2C35F672I8 vs EP2C35F672C7 Comparison
Detailed side-by-side comparison of EP2C35F672I8 by Intel and EP2C35F672C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2C35F672I8 | EP2C35F672C7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | NRND | NRND |
| Family | Cyclone II | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 33,216 | — |
| Embedded Memory (bits) | 483,840 | — |
| Embedded 18x18 Multipliers | 35 | 35 |
| User I/O Pins | 475 | — |
| PLLs | 4 | 4 |
| Process Technology | 90 nm CMOS SRAM | 90 nm low-k CMOS |
| Package | 672-ball FineLine BGA (FBGA) | 672-BGA (FineLine BGA) |
| Package Code | F672 | — |
| Ball Pitch | 1.0 mm | — |
| Operating Temperature (Industrial) | -40C to +100C Tj | — |
| Speed Grade | 8 (C8 core) | 7 (commercial) |
| Supply Voltage (Core) | 1.15 V to 1.25 V | — |
| Supply Voltage (I/O) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage) | — |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| RoHS Status | Compliant (lead-free FBGA) | Compliant |
| Series | — | Cyclone II |
| Logic Elements (LE) | — | 33,216 |
| Embedded Memory Bits | — | 483,840 bits (105 M4K blocks) |
| User I/O Count | — | 475 |
| Core Voltage | — | 1.2 V |
| Operating Temperature | — | 0C to +85C (commercial) |
| Configuration Interface | — | Serial (AS) and Parallel (PS) |
| Memory Interface Support | — | DDR, DDR2, QDRII SRAM |