EP2C50F672C8N vs EP2C50F672C6 Comparison

Detailed side-by-side comparison of EP2C50F672C8N by Intel and EP2C50F672C6 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2C50F672C8N EP2C50F672C6
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy Active
Series Cyclone II Cyclone II
Number of Logic Elements 50,528 —
Number of Logic Array Blocks (LABs) 4,608 —
Total RAM Bits 594,432 —
Number of I/O 450 —
Number of User I/O Banks 8 (per family architecture) —
Number of PLLs 4 —
Number of DLLs 2 —
Embedded 18x18 Multipliers 86 Yes (DSP blocks)
Core Voltage 1.2 V —
Package 672-FBGA (FineLine BGA) 672-ball FBGA (FineLine BGA)
Package Body Size 27 mm x 27 mm —
Mounting Type Surface Mount Surface Mount
Operating Temperature 0C to +85C (commercial) —
Speed Grade C8 —
Process Technology 90 nm low-k CMOS 90 nm CMOS
Configuration JTAG + serial/parallel —
RoHS Status [DATA_NEEDED: rohs status from datasheet] Compliant
Logic Elements (LE) — 50,528
Configurable Logic Blocks (CLB) — 3,158
Embedded Memory Bits — 594,432 bits
Maximum User I/O — 450
Maximum Internal Clock Frequency — 500 MHz
PLLs — 4
Core Supply Voltage (VCCINT) — 1.2 V
Configuration Modes — JTAG, Active Serial, Passive Serial
Operating Temperature Grade — Commercial (0 C to +85 C) - C6 speed grade

Datasheets & Resources

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