EP2C70F896C7K vs EP2C70F896C7 Comparison
Detailed side-by-side comparison of EP2C70F896C7K by Intel and EP2C70F896C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2C70F896C7K | EP2C70F896C7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | NRND |
| Family | Cyclone II | Cyclone II |
| Logic Elements | 68,416 | — |
| Embedded Memory (M4K blocks) | 4,488 Kbits | — |
| Embedded Multipliers (18x18) | 150 | — |
| Maximum User I/O Pins | 622 | — |
| Maximum User I/O (this package) | [DATA_NEEDED: per F896 pinout] | — |
| Phase-Locked Loops (PLLs) | 4 | — |
| Global Clock Networks | 16 | 16 |
| Process Technology | 90 nm low-power CMOS | 90 nm low-k CMOS |
| Core Voltage | 1.2 V | 1.2 V |
| Operating Temperature Grade | Commercial (0C to 85C) | — |
| Package | 896-ball FineLine BGA (F896) | 896-ball FBGA |
| Speed Grade | 7 | C7 (commercial, slowest) |
| Configuration Modes | AS, AP, PS, FPP, JTAG | AS, PS, FPP, JTAG |
| RoHS Status | Compliant | [DATA_NEEDED: confirm per lot] |
| Mounting Type | Surface Mount (BGA) | — |
| Logic Elements (LE) | — | 68,416 |
| Total Memory Bits | — | 1,152,000 |
| Embedded Multipliers (18 x 18) | — | 150 |
| User I/O Pins | — | 622 |
| I/O Bank Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| PLLs | — | 4 |
| Operating Temperature | — | 0C to +85C (commercial) |
| Memory Blocks (M4K) | — | 250 (4 Kbit each) |
| Configuration Bitstream Size | — | [DATA_NEEDED: exact bytes] |