EP2SGX30DF780I5N vs EP2SGX30DF780C5N Comparison

Detailed side-by-side comparison of EP2SGX30DF780I5N by Intel and EP2SGX30DF780C5N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2SGX30DF780I5N EP2SGX30DF780C5N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Last Time Buy
Family Stratix II GX —
Logic Cells 33,880 (33,380 logic elements) —
Logic Array Blocks (LABs) 33,880 —
Process Technology 90 nm CMOS 90 nm CMOS
Core Voltage 1.2 V 1.2 V
Internal Clock Frequency (max) 622.08 MHz —
Number of Transceivers [DATA_NEEDED: transceiver count] —
Number of Pins / Balls 780 —
Package Type FC-FBGA-780 (Flip-Chip Fine-pitch BGA) FC-FBGA-780
Package Size 29 x 29 mm, 1.0 mm pitch 29 mm x 29 mm
Operating Temperature -40C to +85C (Industrial) -40°C to +85°C (extended commercial)
Mounting Type Surface Mount Surface Mount
Lead-Free / RoHS Lead Free (per Kynix listing) —
Speed Grade I5 C5
Temperature Grade Suffix Industrial —
Series — Stratix® II GX
Family Name — Stratix II GX
Logic Elements / Cells — 33,880
LABs / CLBs — 1,694
Total RAM Bits — 1,369,728
User I/O Count — 361
Ball Pitch — 1.0 mm
Internal Frequency (max) — 622 MHz
RoHS Status — Compliant (lead-free finish)
MSL Level — [DATA_NEEDED: MSL level]
Design Tool — Quartus II

Datasheets & Resources

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