EP2SGX90FF1508I3N vs EP2SGX90FF1508I5N Comparison

Detailed side-by-side comparison of EP2SGX90FF1508I3N by Intel and EP2SGX90FF1508I5N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2SGX90FF1508I3N EP2SGX90FF1508I5N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Last Time Buy
Family Stratix II GX Stratix II GX
Logic Elements (LE) 90960 —
Configurable Logic Blocks (CLBs) 90960 —
Embedded Memory (bits) 4520448 —
Memory Blocks TriMatrix (M512/M4K/M-RAM) —
Embedded Multipliers 18x18-bit —
Process Technology 90 nm —
Core Voltage 1.2 V —
Maximum Internal Clock Frequency 816.9 MHz —
Operating Temperature Grade Industrial (-40C to +100C) —
Package 1508-ball FC-FBGA (flip-chip) 1508-ball FC-FBGA (FF1508)
Terminal Form Ball (BGA) —
Number of Terminals 1508 —
Package Shape Square —
Configuration Method EPC enhanced configuration device / JTAG —
Multi-Gigabit Transceivers Embedded (PCIe / RapidIO / GBE capable) —
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS status]
Speed Grade I3N (industrial, fast) I5 (industrial, moderate speed)
Logic Elements (LEs) — 90,960
Total Logic Cells — 90,960
Equivalent Logic Cells — 90,960
Embedded Memory Bits — 4,520,448 bits
Maximum Clock Frequency — 622.08 MHz
Process Node — 90 nm CMOS
Nominal Core Supply Voltage — 1.2 V
User I/O Pins — 650
Total Package Pins — 1,508
Operating Temperature Range — -40 °C to +85 °C (Industrial)
Mounting Type — Surface Mount
LE Count Class — High Density (90K-class)

Datasheets & Resources

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