EP3C10F256C8 vs EP3C10F256C6 Comparison
Detailed side-by-side comparison of EP3C10F256C8 by Intel and EP3C10F256C6 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C10F256C8 | EP3C10F256C6 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | End of Life | Active |
| Device Type | Cyclone III FPGA | — |
| Programmable Logic Elements | 10,320 logic elements | — |
| User I/O Count | 182 I/O | — |
| Performance Frequency | 402 MHz | — |
| Process Technology | 65 nm | 60 nm low-power CMOS |
| Core Supply Voltage | 1.2 V | — |
| Package | 256-LBGA | 256-FBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) |
| Terminal Count | 256 terminals | — |
| Terminal Form | Ball | — |
| Package Shape | Square | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| FPGA Family | Cyclone III | — |
| Programmable Logic Type | Field-programmable gate array | — |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| Embedded Memory | [DATA_NEEDED: embedded memory capacity] | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Block RAM Count | [DATA_NEEDED: block RAM count] | — |
| Maximum I/O Frequency | [DATA_NEEDED: maximum I/O frequency] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | Compliant (lead-free FBGA) |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Family | — | Cyclone III |
| Logic Elements (LE) | — | 10,320 |
| Total Memory Bits | — | 423,936 bits |
| Embedded 18x18 Multipliers | — | 23 |
| PLLs | — | 2 |
| Maximum User I/Os | — | 182 |
| Core Voltage (VCCINT) | — | 1.15 V to 1.25 V (typ. 1.2 V) |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V (bank-dependent) |
| Configuration Memory | — | SRAM-based (external EPCS flash required) |
| Operating Temperature | — | -40 C to +125 C (industrial, suffix 'C') |
| Speed Grade | — | 6 |
| MSL Level | — | 3 (168 hours) |