EP3C10U256C8 vs EP3C10U256C7 Comparison
Detailed side-by-side comparison of EP3C10U256C8 by Intel and EP3C10U256C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C10U256C8 | EP3C10U256C7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Active |
| Device Type | Cyclone III embedded field-programmable gate array | Cyclone III Field Programmable Gate Array (FPGA) |
| Logic Elements | 10,320 logic elements | 10,320 elements |
| Maximum Stated Frequency | 472.5 MHz | — |
| I/O Count | 182 I/O | — |
| Process Technology | 65 nm CMOS | — |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Package | 256-LFBGA | 256-LFBGA |
| Package Ball Count | 256 balls | — |
| Package Body Size | 14 x 14 mm | — |
| Ball Pitch | 0.80 mm | — |
| Device Cell Count | 10,320 cells | — |
| Programmable Logic Type | SRAM-based field-programmable gate array | — |
| Mounting Type | Surface mount | Surface mount |
| Product Family | Cyclone III | Cyclone III |
| Manufacturer | Intel | — |
| Embedded Memory Capacity | [DATA_NEEDED: embedded memory capacity] | — |
| Embedded Hard IP | [DATA_NEEDED: embedded hard IP] | — |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| REACH Status | [DATA_NEEDED: REACH status] | [DATA_NEEDED: REACH compliance status] |
| Embedded Memory | — | 423,936 bits |
| User I/O | — | 182 I/O |
| Package Pin or Terminal Count | — | 256 terminals |
| Package Shape | — | Square |
| Terminal Form | — | BGA ball |
| FPGA Technology | — | 65 nm |
| Temperature Grading | — | Other |
| Unit Price Reference | — | 38.8858 USD as of 2026-10-28 |
| Maximum Clock Frequency | — | [DATA_NEEDED: maximum clock frequency] |