EP3C10U256C8 vs EP3C10U256I7 Comparison
Detailed side-by-side comparison of EP3C10U256C8 by Intel and EP3C10U256I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C10U256C8 | EP3C10U256I7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Active |
| Device Type | Cyclone III embedded field-programmable gate array | Field-Programmable Gate Array (FPGA) |
| Logic Elements | 10,320 logic elements | — |
| Maximum Stated Frequency | 472.5 MHz | — |
| I/O Count | 182 I/O | — |
| Process Technology | 65 nm CMOS | 65 nm |
| Core Supply Voltage | 1.2 V | 1.2 V |
| Package | 256-LFBGA | — |
| Package Ball Count | 256 balls | — |
| Package Body Size | 14 x 14 mm | — |
| Ball Pitch | 0.80 mm | — |
| Device Cell Count | 10,320 cells | — |
| Programmable Logic Type | SRAM-based field-programmable gate array | — |
| Mounting Type | Surface mount | Surface Mount |
| Product Family | Cyclone III | — |
| Manufacturer | Intel | — |
| Embedded Memory Capacity | [DATA_NEEDED: embedded memory capacity] | — |
| Embedded Hard IP | [DATA_NEEDED: embedded hard IP] | — |
| Operating Temperature Range | [DATA_NEEDED: operating temperature range] | — |
| RoHS Status | [DATA_NEEDED: RoHS status] | — |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| FPGA Family | — | Cyclone III |
| Logic Cells | — | 10,320 cells |
| User I/O Count | — | 182 I/O |
| Embedded RAM | — | 423,936 bits |
| Maximum Frequency | — | 437.5 MHz |
| Temperature Grade | — | Industrial |
| Package Code | — | LFBGA |
| Package Type | — | 256-LFBGA |
| Terminal Type | — | Ball |
| Terminal Count | — | 256 balls |
| Package Shape | — | Square |
| Programmability | — | Field Programmable |