EP3C16E144I7 vs EP3C10E144I7N Comparison

Detailed side-by-side comparison of EP3C16E144I7 by Intel and EP3C10E144I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C16E144I7 EP3C10E144I7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active NRND
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Cyclone III —
Logic Cells 15,408 —
I/O Count 84 —
Package 144-LQFP Exposed Pad 144-LQFP Exposed Pad (EQFP-144)
Package Code LFQFP —
Package Body Size 20 x 20 mm —
Package Pitch 0.40 mm —
Pin Count 144 —
Terminal Type Gull wing —
Package Shape Square —
Temperature Grade Industrial —
Mounting Type Surface Mount Surface Mount
Embedded Memory [DATA_NEEDED: embedded memory specification] —
Core Supply Voltage [DATA_NEEDED: core supply voltage] —
I/O Supply Voltage [DATA_NEEDED: I/O supply voltage] —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Configuration Interface [DATA_NEEDED: configuration interface] —
RoHS Status [DATA_NEEDED: RoHS status] Compliant (lead-free, 'N' suffix)
Series — Cyclone® III
Family — Cyclone III (EP3C)
Logic Elements (LE) — 10,320
Logic Array Blocks (LABs) — [DATA_NEEDED: LAB count]
Total Memory Bits — 423,936 bits
Embedded Memory Blocks — 46 M9K blocks
Embedded Multipliers (18x18) — 23
PLLs — 2
User I/O Pins — 94
Maximum Operating Frequency — 472.5 MHz
Process Technology — 65 nm CMOS
Core Voltage (VCCINT) — 1.2 V
I/O Voltage (VCCIO) — 1.2 V to 3.3 V (bank-dependent)
Operating Temperature — -40°C to +100°C (industrial, 'I7' grade)

Datasheets & Resources

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