EP3C40F324C8 vs EP3C40F324C8N Comparison
Detailed side-by-side comparison of EP3C40F324C8 by Intel and EP3C40F324C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C40F324C8 | EP3C40F324C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Active |
| Device Type | Cyclone III field-programmable gate array (FPGA) | — |
| Logic Elements | 39,600 elements | — |
| Maximum Operating Frequency | 402 MHz | — |
| Core Supply Voltage | 1.2 V | — |
| I/O Count | 195 I/O | — |
| Package Type | 324-ball FBGA | — |
| Terminal Count | 324 balls | — |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| Mounting Type | Surface mount | Surface Mount (BGA) |
| Device Family | Cyclone III | — |
| Manufacturer | Intel | — |
| Packaging | Tray | — |
| Programmable Logic | [DATA_NEEDED: embedded memory capacity] | — |
| I/O Standards | [DATA_NEEDED: supported I/O voltage standards] | — |
| Operating Temperature | [DATA_NEEDED: operating temperature range] | 0C to +85C (commercial, C8 suffix) |
| RoHS Status | [DATA_NEEDED: RoHS compliance status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH compliance status] | — |
| Series | — | Cyclone III |
| Family | — | Cyclone III (EP3C40) |
| Logic Elements (LE) | — | 39,600 |
| Embedded Memory (bits) | — | 1,161,216 (~1.16 Mbit) |
| Embedded 18x18 Multipliers | — | 126 |
| Maximum User I/O | — | 215 |
| PLLs | — | 4 |
| Core Voltage | — | 1.2 V |
| Process Technology | — | 60 nm low-power CMOS (TSMC) |
| Maximum Core Frequency | — | 402 MHz (speed grade 8) |
| Configuration Method | — | SRAM (volatile), requires external boot device |
| Package | — | FBGA-324 (324-ball FineLine BGA) |
| Lead-Free | — | Yes |