EP3C40F484I7N vs EP3C40F484C7N Comparison
Detailed side-by-side comparison of EP3C40F484I7N by Intel and EP3C40F484C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C40F484I7N | EP3C40F484C7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Series | Cyclone III | — |
| Family | Cyclone® III | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LE) | 39,600 | — |
| Logic Array Blocks (LAB) | 2,475 | — |
| Embedded Memory (bits) | 1,161,216 | — |
| Embedded Multipliers (18x18) | 126 | — |
| User I/O Pins | 331 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Core Voltage | 1.2 V | — |
| I/O Banks | 8 | — |
| Operating Temperature | -40 °C to +125 °C (Industrial) | 0C to +85C (commercial, C7 speed grade) |
| Package | 484-ball FBGA, 1.0 mm pitch (F484) | 484-FBGA (F484), 1.0 mm pitch |
| Speed Grade | 7 (fast) | — |
| Process Technology | TSMC 65 nm low-power | 65 nm low-power |
| Configuration | AS / AP / PS / FPP / JTAG | — |
| RoHS Status | Compliant | Compliant (lead-free FBGA) |
| Device Family | — | Cyclone III |
| Logic Elements | — | 39,600 |
| Total Memory Bits | — | 1,161,216 |
| Embedded 18x18 Multipliers | — | 126 |
| User I/Os | — | 331 |
| Configuration Memory | — | SRAM-based |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, PCI |
| Mounting Type | — | Surface Mount |
| MSL Level | — | 3 |