EP3C40F780C7N vs EP3CLS100F780C7 Comparison

Detailed side-by-side comparison of EP3C40F780C7N by Intel and EP3CLS100F780C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C40F780C7N EP3CLS100F780C7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $145.40 $632.40
Family Cyclone III Cyclone III LS
Logic Elements 39,600 LE β€”
Total RAM Bits 1,161,216 bits 4,451,328
Embedded Multipliers 126 (18x18) β€”
User I/Os 535 β€”
Package 780-ball FBGA (FineLine BGA) 780-ball FineLine BGA (FBGA-780)
Speed Grade 7 (C7, commercial) 7 (C7)
Process Node 65 nm TSMC low-power β€”
Operating Temperature 0C to +85C (commercial) β€”
Supply Voltage (Core) 1.2 V β€”
Configuration Method JTAG, Active Serial, Passive Serial β€”
PLLs 4 β€”
Global Clock Networks 20 β€”
Lead-Free / RoHS Yes (N suffix) β€”
Moisture Sensitivity Level MSL3 (per J-STD-020) β€”
Logic Elements (LEs) β€” 100,448
Embedded Memory β€” M9K blocks (488 total, 4,451,328 bits)
Embedded 18x18 Multipliers β€” 66
Maximum User I/O Pins β€” 413
Logic Array Blocks (LABs) β€” [DATA_NEEDED: exact LAB count for EP3CLS100]
Package Dimensions β€” 29 mm x 29 mm
Ball Pitch β€” 1.0 mm
Core Supply Voltage (VCCINT) β€” 1.2 V
I/O Supply Voltage (VCCIO) β€” 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank)
Process Technology β€” 60 nm low-power CMOS
Configuration Modes β€” Active Serial (AS), Passive Serial (PS), JTAG
Bitstream Encryption β€” AES-128 (Cyclone III LS security feature)
Operating Junction Temperature β€” 0C to +85C (commercial, 'C' grade)
RoHS Status β€” Compliant (lead-free FBGA)

Datasheets & Resources

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