EP3C40F780C8 vs EP3C40F780C8N Comparison
Detailed side-by-side comparison of EP3C40F780C8 by Intel and EP3C40F780C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C40F780C8 | EP3C40F780C8N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $99.95 | $64.85 |
| Family | Cyclone III | Cyclone III |
| Series | EP3C40 | Cyclone® III |
| Logic Elements | 39,600 | — |
| Total Memory Bits | 1,161,216 bits (1134 Kbit) | 1,161,216 bits |
| Embedded Memory | M9K blocks, 486 Kbit total (per family datasheet) | — |
| Embedded 18x18 Multipliers | 126 | 126 (up to 396 9x9) |
| General Purpose PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Maximum User I/O Pins | 535 | — |
| Process Technology | 65 nm low-power CMOS | 65nm TSMC low-power |
| Package | 780-ball FBGA (FineLine BGA) | 780-ball FBGA, 1.0mm pitch |
| Speed Grade | C8 (commercial, -40C to +85C operating range per 'C' designator family convention) | 8 (C8) |
| User I/O Banks | [DATA_NEEDED: user I/O bank count] | — |
| Supported Memory Interfaces | DDR, DDR2, QDRII SRAM (via dedicated PHY) | — |
| Configuration | Serial (AS) / Parallel (AP) / JTAG | — |
| RoHS Status | Compliant | Compliant |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| Logic Elements (LE) | — | 39,600 |
| Number of LABs/CLBs | — | 2,475 |
| Embedded Memory Blocks | — | M9K x 126 |
| Number of PLLs | — | 4 |
| Maximum User I/Os | — | 535 |
| Number of I/O Banks | — | 9 |
| Core Voltage | — | 1.15V to 1.25V |
| Operating Temperature | — | 0°C to +85°C (Commercial) |
| Configuration Modes | — | AS, PS, FPP, JTAG |