EP3C40F780I7N vs EP3C40F780C7N Comparison
Detailed side-by-side comparison of EP3C40F780I7N by Intel and EP3C40F780C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C40F780I7N | EP3C40F780C7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Series | Cyclone III | — |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 39,600 | 39,600 LE |
| Embedded Memory | 1,161,216 bits (126 M9K blocks) | — |
| Embedded Multipliers | 126 (18x18) | 126 (18x18) |
| User I/O Pins | 535 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Core Voltage | 1.2 V | — |
| Process Technology | 65 nm | — |
| Package | 780-ball FBGA (F780) | 780-ball FBGA (FineLine BGA) |
| Mounting Type | Surface Mount | — |
| Operating Temperature | -40C to +100C (industrial) | 0C to +85C (commercial) |
| Speed Grade | 7 | 7 (C7, commercial) |
| RoHS Status | Compliant | — |
| MSL Level | [DATA_NEEDED: MSL rating] | — |
| Total RAM Bits | — | 1,161,216 bits |
| User I/Os | — | 535 |
| Process Node | — | 65 nm TSMC low-power |
| Supply Voltage (Core) | — | 1.2 V |
| Configuration Method | — | JTAG, Active Serial, Passive Serial |
| Lead-Free / RoHS | — | Yes (N suffix) |
| Moisture Sensitivity Level | — | MSL3 (per J-STD-020) |