EP3C55F484C8 vs EP3C55F484C6N Comparison

Detailed side-by-side comparison of EP3C55F484C8 by Intel and EP3C55F484C6N by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C55F484C8 EP3C55F484C6N
Brand Intel Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $138.40 $148.70
Device Family Cycloneยฎ III โ€”
Logic Elements (LEs) 55,856 โ€”
Logic Array Blocks (LABs) 3,491 โ€”
Embedded Memory Bits 2,396,160 bits โ€”
Embedded 18x18 Multipliers 312 โ€”
User I/Os 327 โ€”
PLLs 4 โ€”
Global Clock Networks 20 โ€”
Maximum Core Frequency 472.5 MHz โ€”
Process Technology 65 nm low-power CMOS 65 nm
Package 484-ball FBGA (FBGA-484), 23 x 23 mm, 1.0 mm pitch, 2.60 mm height โ€”
Speed Grade C8 (commercial, -8) 6 (C6)
Operating Temperature Commercial (0C to +85C) โ€”
Configuration Modes JTAG, Active Serial (AS), Active Parallel (AP), Passive Serial (PS) โ€”
Lead-Free / RoHS Yes (Pb-free FBGA) Lead-free (N suffix)
Supply Voltage Core 1.2 V typical, I/O bank dependent โ€”
I/O Standards Supported LVCMOS, LVTTL, LVDS, SSTL, HSTL, PCI, and others โ€”
Device Type โ€” FPGA - Field Programmable Gate Array
Series โ€” Cyclone III
Number of Logic Elements โ€” 55856
Number of User I/O โ€” 327
Total RAM Bits โ€” 2396160
Core Supply Voltage โ€” 1.2 V
Package / Case โ€” FBGA-484, 23 x 23 mm
Ball Count โ€” 484
Ball Pitch โ€” 1 mm
Package Height โ€” 2.60 mm
Mounting Type โ€” Surface Mount
Operating Temperature Range โ€” 0ยฐC to +85ยฐC
Maximum Internal Frequency โ€” 472 MHz

Datasheets & Resources

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