EP3C55F780C7N vs EP3C120F780C7N Comparison
Detailed side-by-side comparison of EP3C55F780C7N by Intel and EP3C120F780C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C55F780C7N | EP3C120F780C7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Family | Cyclone III | Cyclone III |
| Logic Elements | 55,856 | — |
| Embedded Memory | 2,396,160 bits (approximately 2.4 Mbit) | — |
| Embedded Memory Blocks | 312 M9K blocks | — |
| Embedded Multipliers | 156 (18 x 18) | — |
| User I/O Count | 377 | — |
| PLLs | 4 | 4 |
| Global Clock Networks | 20 | 20 |
| Configuration Memory | 8 Kbits (supports PS, FPP, JTAG) | — |
| Process Technology | 65 nm low-power CMOS | 65 nm low-k |
| Core Voltage (VCCINT) | 1.2 V | 1.2 V |
| I/O Bank Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) | — |
| Operating Temperature | 0C to +85C (commercial, C7 speed grade) | 0C to +85C (commercial) |
| Package | 780-ball FineLine BGA | 780-pin FBGA (F780) |
| Speed Grade | 7 | C7 |
| RoHS Status | Compliant | — |
| Series | — | EP3C120 |
| Logic Elements (LE) | — | 119,088 |
| Total Memory Bits | — | 3,981,312 |
| Embedded Memory Blocks (M9K) | — | 432 |
| 18x18 Hardware Multipliers | — | 531 |
| Maximum User I/O | — | 429 |
| Mounting Type | — | Surface Mount (BGA) |
| Lead-Free / RoHS | — | Yes (suffix N) |
| Configuration Modes | — | AS, AP, FPP, PS, JTAG |