EP3C5F256C8N vs EP3C5U256A7N Comparison

Detailed side-by-side comparison of EP3C5F256C8N by Intel and EP3C5U256A7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C5F256C8N EP3C5U256A7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Series Cyclone III Cyclone III
Device Family Cyclone III (EP3C5) —
Logic Elements (LEs) 5,136 —
Embedded Memory (bits) 423,936 —
Embedded Memory (Kbits) 414 Kbits —
Embedded 18x18 Multipliers 23 —
PLLs 4 —
Maximum User I/Os 182 —
Core Voltage 1.15 V to 1.25 V —
Operating Temperature 0C to 85C (Commercial) —
Package 256-ball FBGA (FineLine BGA) —
Process Technology 65 nm —
Configuration Memory SRAM-based (in-system reprogrammable) —
I/O Standards Supported LVDS, LVTTL, LVCMOS, SSTL, HSTL —
RoHS Status Lead Free (per Altera/Intel product page) Compliant
Mounting Type Surface Mount —
Logic Elements — 5,136 LE
Embedded Memory — 414 kbit (423,936 bits)
Number of I/Os — 182
Operating Supply Voltage (Core) — 1.15 V to 1.25 V
Mounting Style — SMD/SMT
Package / Case — BGA-256 (U256 Ultra FineLine)
Packaging — Tray
Minimum Operating Temperature — -40 C
Maximum Operating Temperature — +125 C (Automotive grade)
Temperature Grade — Automotive
Adaptive Logic Modules (ALMs) — [DATA_NEEDED: ALM count]
Embedded Multipliers (18x18) — [DATA_NEEDED: 18x18 multiplier count]
Number of PLLs — 4
Process Node — 60 nm low-power CMOS
Speed Grade — -7

Datasheets & Resources

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