EP3C5M164I7 vs EP3C5M164I7N Comparison

Detailed side-by-side comparison of EP3C5M164I7 by Intel and EP3C5M164I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Intel
EP3C5M164I7 EP3C5M164I7 - Cyclone III FPGA, 5K LE, 164-MBGA | Intel

EP3C5M164I7 - Cyclone III FPGA, 5K LE, 164-MBGA | Intel

EP3C5M164I7 ⚠ Last Time Buy

Specification Comparison

Parameter EP3C5M164I7 EP3C5M164I7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy Active
Series Cyclone III —
Logic Elements 5,136 —
Total Memory Bits 423,936 (approx. 50 Kbyte) —
Embedded Memory Blocks M9K (9 Kbit blocks) —
Number of M9K Blocks [DATA_NEEDED: M9K block count] —
Embedded 18x18 Multipliers Up to 23 —
PLLs 4 2
Maximum User I/O 106 —
Process Technology 65 nm low-power 60 nm TSMC low-k
Package 164-MBGA (FineLine BGA), 8x8 mm 164-TFBGA (Micro BGA, M164, 8x8 mm)
Operating Temperature (Junction) -40C to +100C (Industrial) —
Supply Voltage - Core 1.2 V —
Configuration Modes JTAG, AS, PS, FPP PS, FPP, AS
Mounting Type Surface Mount Surface Mount
RoHS Status Compliant Compliant
Logic Elements (LE) — 5136
Embedded Memory — 423936 bits (approx. 414 Kbit)
Embedded Multipliers — 23 x 18x18
User I/O Pins — 106
Core Voltage (VCCINT) — 1.2 V
Speed Grade — 7
Temperature Grade — Industrial (-40C to +100C junction)
Ball Pitch — 0.5 mm
External Memory Support — DDR, DDR2, SDR, QDRII+ SRAM
I/O Standards — LVDS, SSTL, HSTL, LVCMOS
MSL Level — [DATA_NEEDED: MSL level]
Operating Junction Temperature — -40C to +100C

Datasheets & Resources

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