EP3C80F780C7N vs EP3C80F780C8N Comparison

Detailed side-by-side comparison of EP3C80F780C7N by Intel and EP3C80F780C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C80F780C7N EP3C80F780C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $260.00 $240.20
Series Cyclone III β€”
Family Name Cyclone III β€”
Number of Logic Elements 81,264 β€”
Number of Logic Cells / CLBs 81,264 β€”
Total RAM Bits 2,810,880 2,810,880 bits
Number of I/O 429 β€”
Number of Gates [DATA_NEEDED: gates count] β€”
Voltage - Supply 1.15 V to 3.3 V (core and I/O banks) β€”
Operating Temperature 0C to +85C (commercial) β€”
Mounting Type Surface Mount Surface Mount
Package / Case 780-BGA (FBGA), 29 x 29 mm, 1.0 mm pitch β€”
Supplier Device Package 780-FBGA β€”
Process Technology 65 nm CMOS (TSMC low-k) β€”
Number of PLLs 4 β€”
Number of Multipliers (18x18) 288 β€”
Maximum Frequency 472.5 MHz β€”
Lead Free / RoHS Lead Free (per LCSC listing) Yes (lead-free)
Configuration Method JTAG, Serial, Parallel (via Quartus Prime / Quartus II) β€”
Family β€” Cyclone III
Device Type β€” FPGA - Field Programmable Gate Array
Logic Elements β€” 81,264
Embedded Multipliers β€” 244 (18x18)
User I/O β€” 429
PLLs β€” 4
Internal Frequency (max) β€” 472 MHz
Number of Pins β€” 780
Package β€” 780-BGA (FBGA), 29 x 29 mm, 1.0 mm pitch
Package Height β€” 2.60 mm
Process Node β€” 60 nm TSMC low-k
Operating Temperature Grade β€” Commercial (C)
Speed Grade β€” 8

Datasheets & Resources

Browse All Products Create BOM Request Quote