EP3CLS150F780C7N vs EP3C80F780C8N Comparison

Detailed side-by-side comparison of EP3CLS150F780C7N by Intel and EP3C80F780C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3CLS150F780C7N EP3C80F780C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $88.40 $240.20
Device Family Cyclone III LS β€”
Logic Elements (LEs) 150,848 β€”
Logic Array Blocks (LABs) 9,428 β€”
Embedded Memory (M9K blocks) 5,994 Kbits β€”
Embedded Multipliers (18x18) 320 β€”
Maximum User I/O Pins 413 β€”
Phase-Locked Loops (PLLs) 4 β€”
Process Technology 65 nm CMOS β€”
Core Supply Voltage 1.2 V β€”
Maximum Operating Frequency 437.5 MHz β€”
External Memory Interfaces DDR2 SDRAM, QDRII+ SRAM β€”
Package 780-ball FBGA (29x29 mm, 1.0 mm pitch) 780-BGA (FBGA), 29 x 29 mm, 1.0 mm pitch
Speed Grade C7 (commercial, -7 speed grade) 8
Configuration Methods JTAG, Active Serial (AS), Passive Serial (PS) β€”
Operating Temperature 0C to +85C (commercial) β€”
RoHS Status Compliant β€”
Family β€” Cyclone III
Device Type β€” FPGA - Field Programmable Gate Array
Logic Elements β€” 81,264
Total RAM Bits β€” 2,810,880 bits
Embedded Multipliers β€” 244 (18x18)
User I/O β€” 429
PLLs β€” 4
Internal Frequency (max) β€” 472 MHz
Number of Pins β€” 780
Package Height β€” 2.60 mm
Mounting Type β€” Surface Mount
Lead Free / RoHS β€” Yes (lead-free)
Process Node β€” 60 nm TSMC low-k
Operating Temperature Grade β€” Commercial (C)

Datasheets & Resources

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