EP3CLS200F484C7 vs EP3CLS200F484C7N Comparison
Detailed side-by-side comparison of EP3CLS200F484C7 by Intel and EP3CLS200F484C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3CLS200F484C7 | EP3CLS200F484C7N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $1,720.00 | $1,650.00 |
| Family | Cyclone III LS | β |
| Logic Elements (LE) | 198,464 | 198,464 |
| Logic Array Blocks (LABs) | 12,408 | β |
| Embedded Memory (RAM bits) | 8,211,456 | β |
| Maximum User I/Os | 226 | β |
| DSP Blocks | 396 (18x18 multipliers) | β |
| PLLs | 4 | 4 |
| Core Supply Voltage (VCCINT) | 1.2 V | β |
| I/O Supply Voltage (VCCIO) | 1.2 V to 3.3 V | β |
| Package | 484-ball FBGA (F484), 23 x 23 mm, 1.0 mm pitch | 484-ball FBGA (FineLine BGA, 23x23 mm) |
| Process Technology | CMOS, low-power | 65 nm low-power CMOS |
| Operating Temperature | 0C to +85C (commercial, C7 speed grade) | 0C to +85C (commercial) |
| Configuration Method | JTAG, Passive Serial, Active Serial | β |
| RoHS Status | Compliant | Compliant |
| Mounting Type | Surface Mount (BGA) | Surface Mount |
| Series | β | Cyclone III LS |
| Logic Array Blocks (LAB) | β | 12,404 |
| Embedded Memory | β | 8,211,456 bits |
| Embedded 18x18 Multipliers | β | 210 |
| User I/O | β | 226 |
| Core Voltage | β | 1.2 V |
| Configuration Modes | β | AS, PS, JTAG (IEEE 1149.1) |
| I/O Standards | β | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Number of I/O Banks | β | 8 |
| Hot Socketing | β | Supported |